Time-domain scattering method using triangle impulse responses for modeling electronic packaging components

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967609

Zhaoqing Chen, A. Ruehli

引用次数: 5

Abstract

This paper describes a time-domain scattering method using triangle impulse response for modeling electronic packaging components such as connectors and vias. The method provides a direct data interface for linear component models to time-domain EM/circuit simulation tools.

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利用三角脉冲响应的时域散射法模拟电子封装元件

本文描述了一种利用三角脉冲响应的时域散射方法对电子封装元件(如连接器和过孔)进行建模。该方法为线性元件模型与时域电磁/电路仿真工具提供了一个直接的数据接口。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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