Flow network modeling for improving flow distribution of microelectronics burn-in oven

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI:10.1109/ITHERM.2000.866811

Bin Lian, T. Dishongh, D. Pullen, Hongfei Yan, J. Chen

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引用次数: 8

Abstract

Modern microelectronics, especially high performance microprocessors need to go through rigorous test and stressing to identify infant mortality failure. One of the stressing procedures is performed by running the devices at elevated temperature for prolonged period of time. With the ever faster microprocessor speed and device power, current burn-in solutions will not be enough to accommodate future generation of products. This study investigated the enhancement of local heat transfer by restricting open flow paths and redirection of cooling flow to the burn-in devices, through flow analysis with Flow Network Modeling software. A hierarchical modeling approach was used in which the flow characteristics of burn-in socket were derived, from which the burn-in board model was built, and a system level model was eventually assembled. Case study for a 3/spl times/5 burn-in board was conducted using Flow Network Modeling software and numerical results are presented.

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改善微电子烧结炉流动分布的流动网络建模

现代微电子，特别是高性能微处理器，需要经过严格的测试和压力，以确定婴儿死亡率失败。其中一个应力过程是通过在高温下长时间运行装置来完成的。随着越来越快的微处理器速度和设备功率，目前的老化解决方案将不足以适应下一代产品。本研究通过flow Network Modeling软件的流动分析，研究了通过限制开放流动路径和将冷却流重定向到老化装置来增强局部传热的方法。采用分层建模方法，推导出老化插座的流动特性，并以此为基础建立老化板模型，最终组装出系统级模型。利用Flow Network Modeling软件对3/ sp1次/5次的烧损板进行了实例分析，并给出了数值结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)

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