Novel HBT structure for high f/sub t/ at low current density

C.E. Chang, P. Asbeck, L. Tran, D. Streit, A. Oki
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引用次数: 4

Abstract

Through modifications of the epitaxial structure of a GaAs/AlGaAs HBT, the junction capacitance (C/sub be/) and recombination rate in the base-emitter junction region have been substantially reduced. The modified structure leads to both higher f/sub t/ and higher /spl beta/ at low current densities (10/sup 2spl les/J/sub cspl les/10/sup 4/ A/cm/sup 2/). The modifications include a lightly doped emitter (LDE) and a strategically placed /spl delta/-doping layer. Device simulations were used to optimize the LDE length and location of the /spl delta/-doping. The experimental results of a fabricated device with a 1370 /spl Aring/ LDE+/spl delta/-doping yielded a 3.3x reduction in C/sub be/, a 2.7x increase in f/sub t/, and a 2x increase in /spl beta/ over the baseline device at low J/sub c/ (J/sub cspl les/10/sup 3/ A/cm/sup 2/).<>
在低电流密度下实现高f/sub - t/的新型HBT结构
通过修改GaAs/AlGaAs HBT的外延结构,大大降低了基极-发射极结区的结电容(C/sub /)和复合速率。在低电流密度(10/sup 2spl les/J/sub cspl les/10/sup 4/ A/cm/sup 2/)下,改进的结构导致更高的f/sub t/和更高的/spl beta/。修改包括一个轻掺杂的发射极(LDE)和一个策略性放置的/spl δ /掺杂层。利用器件模拟优化了LDE长度和/spl δ /-掺杂位置。实验结果表明,在低J/sub C/ (J/sub cspl les/10/sup 3/ a/ cm/sup 2/)下,与基线器件相比,1370 /spl Aring/ LDE+/spl δ /-掺杂制备的器件的C/sub be/降低了3.3倍,f/sub t/增加了2.7倍,/spl beta/增加了2倍
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