The Impact of the Dead-Time on the Reverse Recovery Behavior of SiC-MOSFET Body Diodes

Xing Liu, Xupeng Li, C. Herrmann, T. Basler
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引用次数: 1

Abstract

The impact of the dead-time on the body diode reverse recovery behavior for 1.2 kV silicon carbide MOSFETs has been studied in this paper. The plasma formation behavior of the body diode at different temperatures and load currents is investigated firstly. The time for the plasma stabilization can be estimated. Afterwards, the influence of the load current amplitude, the operating temperature, and the switching speed have been investigated with standard double-pulse tests. Different MOSFET cell designs of various manufacturers were compared. It has been found that selecting a suitable dead-time and switching speed is essential for the optimization of the overall losses, especially at higher operation temperatures.
死区时间对SiC-MOSFET体二极管反向恢复行为的影响
本文研究了死区时间对1.2 kV碳化硅mosfet体二极管反向恢复行为的影响。首先研究了体二极管在不同温度和负载电流下的等离子体形成行为。等离子体稳定的时间是可以估计的。然后,通过标准双脉冲试验研究了负载电流幅值、工作温度和开关速度的影响。比较了不同厂家的MOSFET电池设计。研究发现,选择合适的死区时间和开关速度对于优化总体损耗至关重要,特别是在较高的工作温度下。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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