T. Letavic, R. Cook, R. Brock, H. Effing, R. Einerhand
{"title":"20V Asymmetric Complementary Power Device Implementation within a 0.25um CMOS Technology for Power Management","authors":"T. Letavic, R. Cook, R. Brock, H. Effing, R. Einerhand","doi":"10.1109/ISPSD.2005.1488027","DOIUrl":null,"url":null,"abstract":"This paper presents a process flow in which a 20V-class of power devices is added to baseline 0.25mum CMOS technology by forming asymmetric extended-drain device structures in which shallow-trench-isolation (STI) is incorporated within the device unit cell, forming a gate extended-drain dielectric region. The Rsp-BVds figure-of-merit is consistent with best-in-class for this device construction (0.16 mOhm cm2/24V), and the isolated high-voltage diode capability make this process cost-effective for implementation of mobile power management circuit topologies, including multiple-output DC-DC converters, battery chargers, linear regulators, audio power amplifiers, and white-light backlighting systems","PeriodicalId":154808,"journal":{"name":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2005.1488027","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11
Abstract
This paper presents a process flow in which a 20V-class of power devices is added to baseline 0.25mum CMOS technology by forming asymmetric extended-drain device structures in which shallow-trench-isolation (STI) is incorporated within the device unit cell, forming a gate extended-drain dielectric region. The Rsp-BVds figure-of-merit is consistent with best-in-class for this device construction (0.16 mOhm cm2/24V), and the isolated high-voltage diode capability make this process cost-effective for implementation of mobile power management circuit topologies, including multiple-output DC-DC converters, battery chargers, linear regulators, audio power amplifiers, and white-light backlighting systems