High-performance AlInP/AlImAs/GaInAs HEMT with a partially-doped graded pseudomorphic channel

K. Chough, J. Song, C. Caneau, B.W.-P. Hong
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Abstract

Despite significant improvements of the transconductance and speed of pseudomorphic AlInAs/GaInAs HEMTs, these devices suffer from low channel breakdown voltage and large outputconductance. Especially, in power applications, the drain current handling capability is limited by low channel and gate breakdown voltages [l]. This is mainly due to lower bandgap of the channel and strong localization of the 2DEG distribution at the interface. Our previous work showed that this problem can be solved by grading indium mole fraction in the pseudomorphic GaInAs channel [2]. In this work, we demonstrate a novel InP-based HEMT where partial grading of doping is employed in lower half of the pseudomorphic channel. This resulted in significant increase of the drain current handling cability without degrading channel breakdown voltage and other dc and rf performances. The device structures were grown by low-pressure OMCVD. All five device structures were identical except that the channel composition was changed in a systematic way. The total channel thickness also remained at 300 A. The Gal,,In,As channel of Devices A and By had a dorm indium composition (x) of 0.53 and 0.7, respectively. Devices C had a channel with x graded from 0.7 to 0.53. Device D was similar to Device C except the doping level in the doped AlInAs layer is reduced and the doping of the channel is graded from 0 ~m-~ to 2 x IOl7 ~m-~. For comparison, the whole channel of Device E was unformly doped (1 x lo1* ~m-~) without AlInAs doped layer above the channel. An &,2h08P ternary is used as a Schottky layer to increase the Schottky barrier height. A standard 0.7 pm gate FET processing was employed to fabricate the devices on the epitaxial wafers. All five devices had excellent Schottky diode characteristics. This is due to a high bandgap (-1.8 ev) of the high-quality &2%.8P Schottky layer. The transconductance (gm) and current-gain cutoff frequency (fT) were signrficantly increased with the increase of the indium composition as expected. Device B had 5 1 % higher gm (800 mS/mm) and 30 % higher fT (61 GHz) than Device A. However, the channel breakdown voltage (BVh=3.5V) and output conductance &=85 mS/mm) of device B became considerably poorer. However, by grading the channel composition (Device C), channel breakdown voltage (BVb=9V) and output conductance (&,do mS/mm) characteristics can be significautly improved. Final challenge is to modi6 the structure of Device C to increase the drain current handling capability, while keeping high gm and fT. As clear With Device D (graded x=0.7 to 0.6, and partially doped), doping grading significantly increases the drain current density (ID max = 1000 mA/m) and decreases go (24 mS/mm) while gm (590 mS/mm), fT (47 GHz), and BVh (7 V) are comparable to those of Device C. Device D also showed very high power-gain cutoff fiequency (f-) of 1 10 GHz. In conclusion, the studies demonstrate that the partiallydoped graded channel of InP-based pseudomorphic HEh4T's significantly enhances the advantages of these devices. [l] Y.Kwon etal. in Proc. 5th Cod. InP and related materials, WA2, pp. 465468, 1993. [2] K. B.Chough et al., IEDM Digest pp. 787-790, 1993.
具有部分掺杂渐变伪晶通道的高性能AlInP/AlImAs/GaInAs HEMT
尽管伪晶AlInAs/GaInAs hemt的跨导性和速度有了显著改善,但这些器件的通道击穿电压低,输出电导大。特别是,在功率应用中,漏极电流处理能力受到低通道和栅极击穿电压的限制[1]。这主要是由于通道的带隙较低以及界面处2DEG分布的强局域化。我们之前的工作表明,这个问题可以通过在伪晶GaInAs通道中分级铟摩尔分数来解决[2]。在这项工作中,我们展示了一种新的基于inp的HEMT,其中在假晶通道的下半部分采用了部分分级掺杂。这导致了漏极电流处理能力的显著提高,而不会降低通道击穿电压和其他直流和射频性能。采用低压OMCVD法生长器件结构。除了通道组成以系统的方式改变外,所有五种器件结构都是相同的。总通道厚度也保持在300a。器件A和By的Gal、In、As通道的铟成分(x)分别为0.53和0.7。设备C有一个通道,x从0.7到0.53分级。器件D与器件C相似,只是掺杂AlInAs层的掺杂水平降低了,通道的掺杂程度从0 ~m-~渐变到2 × IOl7 ~m-~。相比之下,Device E的整个通道被均匀掺杂(1 x lo1* ~m-~),通道上方没有掺杂AlInAs层。采用&,2h08P三元结构作为肖特基层,增加肖特基势垒高度。采用标准的0.7 pm栅极场效应管工艺在外延片上制造器件。这五个器件都具有优异的肖特基二极管特性。这是由于高带隙(-1.8 ev)的高质量&2%。8P肖特基层。跨导率(gm)和电流增益截止频率(fT)随铟含量的增加而显著增加。器件B的gm (800 mS/mm)比器件a高5.1 %,fT (61 GHz)比器件a高30%。然而,器件B的通道击穿电压(BVh=3.5V)和输出电导&=85 mS/mm变得相当差。然而,通过分级通道组成(器件C),通道击穿电压(BVb=9V)和输出电导(&,do mS/mm)特性可以显著改善。最后的挑战是modi6装置的结构C增加漏电流处理能力,同时保持高通用和英国《金融时报》,明确设备D(分级x = 0.7 - 0.6,部分掺杂),掺杂评分显著增加漏电流密度(ID max = 1000 mA / m)和减少(24女士/毫米),而通用汽车(590 mS /毫米),英国《金融时报》(47 GHz), BVh (7 V)相媲美的装置C装置D上也显示出非常高的功率增益截止(f) 1 10 GHz。综上所述,这些研究表明,部分掺杂的基于inp的伪晶HEh4T渐变通道显著增强了这些器件的优势。[1]王志强,王志强。第5章。[p]与相关材料,《中华人民共和国》,1993。[2]张志强,李志强,《中国环境科学》,1993。
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