Design considerations for 50G+ backplane links

T. Toifl, M. Braendli, A. Cevrero, P. Francese, M. Kossel, L. Kull, D. Luu, C. Menolfi, T. Morf, Ilter Özkaya, Hazar Yueksel
{"title":"Design considerations for 50G+ backplane links","authors":"T. Toifl, M. Braendli, A. Cevrero, P. Francese, M. Kossel, L. Kull, D. Luu, C. Menolfi, T. Morf, Ilter Özkaya, Hazar Yueksel","doi":"10.1109/ESSCIRC.2016.7598345","DOIUrl":null,"url":null,"abstract":"The constantly increasing need for I/O bandwidth push electrical backplane links to data rates of 50Gb/s and above. Although board materials have improved significantly, backplane links are increasingly limited by signal attenuation while suffering from ISI, jitter, device noise and cross-talk. In this paper we summarize these limitations, and show possible directions to cope with them in order to further extend the achievable data rate.","PeriodicalId":246471,"journal":{"name":"ESSCIRC Conference 2016: 42nd European Solid-State Circuits Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ESSCIRC Conference 2016: 42nd European Solid-State Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSCIRC.2016.7598345","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

The constantly increasing need for I/O bandwidth push electrical backplane links to data rates of 50Gb/s and above. Although board materials have improved significantly, backplane links are increasingly limited by signal attenuation while suffering from ISI, jitter, device noise and cross-talk. In this paper we summarize these limitations, and show possible directions to cope with them in order to further extend the achievable data rate.
50G+背板链路的设计注意事项
不断增长的I/O带宽需求推动电背板链路达到50Gb/s及以上的数据速率。虽然电路板材料有了显著的改进,但背板链路越来越受到信号衰减的限制,同时受到ISI、抖动、器件噪声和串扰的影响。在本文中,我们总结了这些限制,并指出了可能的方向,以进一步扩大可实现的数据速率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信