ION Degradation in Si Devices in Harsh Radiation Environments: Modeling of Damage-Dopant Interactions

P. López, M. Aboy, I. Muñoz, I. Santos, L. Marqués, C. Couso, M. Ullán, L. Pelaz
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引用次数: 1

Abstract

Electronic devices operating in harsh radiation environments must withstand high radiation levels with minimal performance degradation. Recent experiments on the radiation hardness of a new vertical p-type JFET power switch have shown a significant reduction of forward drain current under non-ionizing conditions. In this work, atomistic simulations are used to study the impact of irradiation-induced displacement damage on forward characteristics. Damage models have been updated to produce a better description of damage-dopant interactions at RT. Our results show that excess self-interstitials produced by irradiation deactivate a significant amount of B atoms, thus reducing the effective dopant concentration.
在恶劣辐射环境下硅器件中的离子降解:损伤-掺杂相互作用的建模
在恶劣的辐射环境中工作的电子设备必须承受高辐射水平,并使性能下降到最小。最近对一种新型垂直p型JFET功率开关的辐射硬度的实验表明,在非电离条件下,正向漏极电流显著降低。在这项工作中,原子模拟研究了辐照引起的位移损伤对正演特性的影响。损伤模型已被更新,以更好地描述损伤-掺杂剂在rt中的相互作用。我们的研究结果表明,辐射产生的过量自间隙使大量B原子失活,从而降低了有效掺杂剂的浓度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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