The Effects of Entrapped Bubbles in Solder Used for the Attachment of Leadless Ceramic Chip Carriers

Abstract

This study involves work associated with the effects of trapped gas pockets in solder joints formed by solder pastes used to attach leadless ceramic chip carriers (LCCC) to various substrates. The results indicate that the fatigue life of these joints is dramatically affected by the absence or presence of these bubbles. A somewhat informal survey of other investigators involved in the attachment of LCCC devices suggests that the solder voiding problem is widespread and may well be a leading factor in joint reliability. A motion picture analysis of the phenomenon of gasification will be shown to illustrate this problem.