{"title":"Multifunctional AESA Technology Trends - A Radar System Aspects View","authors":"M. Brandfass, Markus Boeck, R. Bil","doi":"10.1109/PAST43306.2019.9021067","DOIUrl":null,"url":null,"abstract":"Progressive trends in ultra-broadband active electronically scanned array (AESA) antennas for multifunctional RF sensor systems are discussed with their inherent system aspects to cope with. New scalable and modular AESA concepts to reduce size, weight, power and costs (SWAP-C), as well as the prospects of digital frontends with their technological challenges and operational benefits are presented. Furthermore special topics of state of the art AESA component technologies such as GaN-SiGe transmit-receive module (TRM) designs, novel developing trends from multi-chip to two-chip TRMs, as well as surface mounted device (SMD) capable system on chip (SoC) monolithic microwave integrated circuits (MMICs) and digital SoC are addressed.","PeriodicalId":410526,"journal":{"name":"2019 IEEE International Symposium on Phased Array System & Technology (PAST)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE International Symposium on Phased Array System & Technology (PAST)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PAST43306.2019.9021067","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Progressive trends in ultra-broadband active electronically scanned array (AESA) antennas for multifunctional RF sensor systems are discussed with their inherent system aspects to cope with. New scalable and modular AESA concepts to reduce size, weight, power and costs (SWAP-C), as well as the prospects of digital frontends with their technological challenges and operational benefits are presented. Furthermore special topics of state of the art AESA component technologies such as GaN-SiGe transmit-receive module (TRM) designs, novel developing trends from multi-chip to two-chip TRMs, as well as surface mounted device (SMD) capable system on chip (SoC) monolithic microwave integrated circuits (MMICs) and digital SoC are addressed.