Thermal analysis of DC/DC module

Abstract

Ever-increasing DC/DC power density and peak temperature challenge its reliability and performance. Thermal simulation and analysis play a significant role in development of new generation of DC/DC package design. This paper presents an accurate and fast approach to simulate the thermal distribution of a DC/DC module. The thermal distribution is simulated with ANSYS, and verified by infrared thermal images. This made feasible the thermal design to reduce stressing temperature peaks, so improving DC/DC reliability significantly.