Signatures of Positive Gate Over-Drive Induced Hole Trap Generation and its Impact on p-GaN Gate Stack Instability in AlGaN/GaN HEMTs

R. Malik, Vipin Joshi, R. R. Chaudhuri, Mehak Ashraf Mir, Zubear Khan, Avinas N. Shaji, Madhura Bhattacharya, Anup T. Vitthal, M. Shrivastava
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引用次数: 2

Abstract

In this work, we probe the physical mechanism responsible for V th and gate current instability in p-GaN Schottky gated AlGaN/GaN HEMTs. Devices exhibited a negative Vth shift accompanied by a distinct increase in gate current, followed by gate failure, when driven at positive gate over-drives. Temperature and frequency dependent CV analysis is carried out along with capacitive-DL TS measurements to probe and validate the physical mechanism responsible for the observed gate instabilities. Generation of hole traps with an energy level of 0.43e V, in response to gate bias stress is found to trigger gate instability, subsequently leading to device failure.
AlGaN/GaN hemt中正栅极过驱动诱导空穴阱产生的特征及其对p-GaN栅极堆叠不稳定性的影响
在这项工作中,我们探讨了p-GaN肖特基门控AlGaN/GaN hemt中V和栅电流不稳定的物理机制。器件表现出负的Vth位移,伴随着栅极电流的明显增加,随后是栅极故障,当驱动在正栅极过驱动。温度和频率相关的CV分析与电容- dl TS测量一起进行,以探测和验证导致观察到的栅极不稳定性的物理机制。在栅极偏置应力作用下产生的能级为0.43e V的空穴陷阱会触发栅极失稳,从而导致器件失效。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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