Effect of polysilicon gate doping concentration variation on MOSFET characteristics

R. Dutta, S. Kundu
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引用次数: 2

Abstract

Polysilicon gates have replaced the metal gates in CMOS technology. If the doping is not high enough in polysilicon then the flatband voltage should be corrected. Polysilicon gates are also depleted with the application of gate voltage. The dependence of MOSFET current (Ids) on polysilicon gate concentration is studied using the results simulated by Sentaurus TCAD tool in case of N channel MOSFETs. With the decrease in polysilicon gate doping concentration (Nd), the drain current is more degraded. A theory is developed, in order to explain the simulation results that take into consideration the correction in flatband voltage and the voltage drop due to polysilicon depletion. From the analysis of simulated and theoretical curves, an inversion region is suspected to occur at the polysilicon gate for low doping concentration at high gate voltage.
多晶硅栅掺杂浓度变化对MOSFET特性的影响
多晶硅栅极已经取代了CMOS技术中的金属栅极。如果多晶硅中的掺杂不够高,则应校正平带电压。多晶硅栅极也随着栅极电压的施加而耗尽。以N沟道MOSFET为例,利用Sentaurus TCAD仿真工具,研究了MOSFET电流(Ids)与多晶硅栅极浓度的关系。随着多晶硅栅掺杂浓度(Nd)的降低,漏极电流的衰减程度越高。为了解释考虑平带电压校正和多晶硅损耗引起的电压降的仿真结果,提出了一种理论。从模拟曲线和理论曲线的分析来看,在高栅极电压和低掺杂浓度条件下,多晶硅栅极可能出现反转区。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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