Emerging technigues in SIP and SoC - Session 31

Abstract

This session presents emerging technologies that facilitate the integration of system-in-package (SIP) or system-on-chip (SOC). This includes the integration, in a single package or a single chip, of non-transistor components such as electro-mechanical-devices, integrated antennas, high-quality inductors, and image sensors. The first two papers are invited tutorials. The first invited paper gives an overview of different approaches for the integration of multi-chip system-in-packages. The second invited paper gives an overview on the design of microsystems. These microsystems include different types of integrated sensors or actuators. The remaining four papers highlight specific technology advances. The first of these papers shows a system that includes a MEMS strain sensor interfaced with CMOS electronics that improves any prior strain sensing technology. The next paper shows new results in the implementation of integrated antennas in silicon substrates. Experimental data shows the feasibility of free-space communication with these integrated antennas. The next paper shows a low-power voltage-controlled oscillator with a thin-film post-processed inductor. This type of inductor has a high quality factor of 40 at a target frequency of 5 GHz. The final paper shows a CMOS 3D camera chip. The chip includes an array of 32x32 extremely sensitive image sensors. A time-of-flight measurement technique is used to calculate distances between a target scene and the chip camera sensors.