Thermal Aware Processor Operation Point Management

Naga Pavan Kumar Gorti, Arun Kumar Somani
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Abstract

Existing schemes for dynamic voltage and frequency scaling (DVFS) do not account for the intertask thermal cycles. The chip reliability testing process usually also is not inclusive of test cases quantifying the chip reliability in the presence of small scale thermal cycles. However, a good number of in-field chip failures are attributed to the consequences of thermal cycles. Thus, it is imperative to include their effects into the processor voltage and frequency selection process. Our work focuses on developing an integrated processor thermal and performance management system centered on novel polynomial time scheduling algorithms that achieve minimal thermal cycle guarantees in soft real time environments. Our scheme leverages application awareness and runtime monitoring for improving the lifetime of the chip, while achieving considerable energy savings. Our scheme shows a significant reduction in thermal cycles and peaks, leading to longer chip life expectations. Our results indicate a 10 fold increase in the expected chip lifetime and 50% energy savings compared to operation at the rated maximum voltage and frequency.
热感知处理器操作点管理
现有的动态电压和频率标度(DVFS)方案没有考虑任务间热循环。芯片可靠性测试过程通常也不包括在小规模热循环中量化芯片可靠性的测试用例。然而,大量的现场芯片故障归因于热循环的后果。因此,必须在处理器电压和频率选择过程中考虑它们的影响。我们的工作重点是开发一个集成的处理器热和性能管理系统,该系统以新颖的多项式时间调度算法为中心,在软实时环境中实现最小的热循环保证。我们的方案利用应用程序感知和运行时监控来提高芯片的使用寿命,同时实现相当大的节能。我们的方案显着减少了热循环和峰值,从而延长了芯片的预期寿命。我们的研究结果表明,与在额定最大电压和频率下工作相比,预期芯片寿命增加了10倍,节能50%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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