A new instrument and technique for diagnosing electromagnetic design problems in microwave module housings and component packages

D. Griffin
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引用次数: 2

Abstract

With the aim of diagnosing electromagnetic (EM) design problems in microwave module housings and component packages, a method of measuring the frequencies at which resonances occur and the distribution of the associated electric field intensity at the inside face of the housing or package lid has been developed and tested. The method does not require modification of the connections to the microwave assembly within the housing. The housing or package only need have a flat lid and that it be left off so that the item under test can be mounted on an equivalent flat plate on the test instrument. The microwave assembly in the housing or package may be operated normally while resonant field distributions are being measured. The prototype instrument yields results that demonstrate the practical application of this measurement assembly as a diagnostic and design development tool for microwave housings and packages of rectangular metal box shape. Resonances in the 8-12-GHz range have been accurately measured and indicate that by scaling dimensions an assembly for use at millimeter wavelengths is feasible.<>
一种诊断微波模块外壳和元件封装电磁设计问题的新仪器和新技术
为了诊断微波模块外壳和组件封装中的电磁(EM)设计问题,已经开发并测试了一种测量谐振发生频率和外壳或封装盖内表面相关电场强度分布的方法。该方法不需要修改外壳内与微波组件的连接。外壳或包装只需要有一个平盖,并且它可以被关闭,以便被测物品可以安装在测试仪器上的等效平板上。在测量谐振场分布时,壳体或封装中的微波组件可以正常工作。原型仪器产生的结果证明了该测量组件作为矩形金属盒形状微波外壳和封装的诊断和设计开发工具的实际应用。8- 12ghz范围内的共振已被精确测量,并表明通过缩放尺寸,用于毫米波长的组件是可行的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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