SPICE simulation of RRAM circuits. A compact modeling perspective

G. González-Cordero, J. Roldán, F. Jiménez-Molinos
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引用次数: 2

Abstract

Two different compact models for resistive RAM (RRAMs) with filamentary conduction are compared in depth. One model describes RRAMs where conductive filaments (CFs) change their geometry laterally while the other model takes into consideration vertical variations of the CF. The role of the conductive filament (CF) ohmic resistance and the temperature evolution is carefully studied. The models have been implemented in SPICE to analyze circuits under step pulsed signals and voltage ramps. A single non-volatile memory cell using a NMOS transistor as selector device is studied in depth.
RRAM电路的SPICE仿真。紧凑的建模透视图
对两种不同的具有细丝传导的电阻式RAM的紧凑模型进行了深入的比较。一个模型描述了导电丝(CF)横向改变其几何形状的rram,而另一个模型考虑了CF的垂直变化。仔细研究了导电丝(CF)欧姆电阻和温度演变的作用。该模型已在SPICE中实现,用于分析阶跃脉冲信号和电压坡道下的电路。对采用NMOS晶体管作为选择器件的单非易失性存储单元进行了深入研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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