Design enablement of CFET devices for sub-2nm CMOS nodes

O. Zografos, B. Chehab, P. Schuddinck, G. Mirabelli, N. Kakarla, Y. Xiang, P. Weckx, J. Ryckaert
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引用次数: 4

Abstract

Novel devices that optimize their structure in a three-dimensional fashion and offer significant area gains by reducing standard cell track height are adopted to scale silicon technologies beyond the 5nm node. Such a device is the Complementary FET (CFET), which consists of an n-type channel stacked vertically over a p-type channel. In this paper we review the significant benefits of CFET devices as well as the challenges that arise with their use. More specifically, we focus on the standard cell design challenges as well as the physical implementation ones. We show that to fully exploit the area benefits of the CFET devices, one must carefully select the metal stack used for the physical implementation of a large design.
亚2nm CMOS节点的CFET器件的设计实现
新型器件以三维方式优化其结构,并通过降低标准电池轨道高度提供显着的面积增益,用于扩展超过5nm节点的硅技术。这种器件就是互补场效应管(CFET),它由一个n型沟道垂直堆叠在一个p型沟道上组成。在本文中,我们回顾了CFET器件的显著优点以及使用时出现的挑战。更具体地说,我们专注于标准单元设计挑战以及物理实现挑战。我们表明,为了充分利用CFET器件的面积优势,必须仔细选择用于大型设计的物理实现的金属堆。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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