Design of Tunnel Junction Engineered Dopingless TFET for Low power Applications

A. Verma, Suruchi Sharma, Sneha Bharti, Manisha Bharti, B. Kaur
{"title":"Design of Tunnel Junction Engineered Dopingless TFET for Low power Applications","authors":"A. Verma, Suruchi Sharma, Sneha Bharti, Manisha Bharti, B. Kaur","doi":"10.1109/ISDCS49393.2020.9262986","DOIUrl":null,"url":null,"abstract":"Dopingless tunnel field-effect transistor (DLTFET) has emerged to eliminate MOSFET as promising minimal-power applications in emerging technologies. While, throughout this paper, we produced a new DLTFET based charge plasma tunnel junction. A gallium arsenide (GaAs) pocket is positioned around across source and channel interface of the silicon film, increasing the likelihood of tunneling. Although GaAs energy bandgap seems to be significantly beyond a silicon energy bandgap, it does have fast electron mobility and minimal tunneling mass, contributing to enhanced current drivability at the interface. In contrast, with the standard DLTFET and tunnel junction engineered DLTFET (GaAs-DLTFET) we properly assessed the DC and analog/RF values in specific terms of energy band diagram, electric field, carrier concentrations, transfer characteristics, transconductance, parasitic capacitance, cutoff frequency. The simulation of the conventional DLTFET and proposed device (GaAs-DLTFET) has been performed using the ATLAS device simulator. The proposed device has shown an increased ON-current (~100 μA/μm) and improved subthreshold swing (~10.25 mV/decade). The excellent characteristics are demonstrated by GaAs-DLTFET and linearity parameters are analyzed to give the justification that a device is a worthy option for future high-frequency analog/RF applications with minimal use of operational power.","PeriodicalId":177307,"journal":{"name":"2020 International Symposium on Devices, Circuits and Systems (ISDCS)","volume":"128 6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-03-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 International Symposium on Devices, Circuits and Systems (ISDCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISDCS49393.2020.9262986","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

Abstract

Dopingless tunnel field-effect transistor (DLTFET) has emerged to eliminate MOSFET as promising minimal-power applications in emerging technologies. While, throughout this paper, we produced a new DLTFET based charge plasma tunnel junction. A gallium arsenide (GaAs) pocket is positioned around across source and channel interface of the silicon film, increasing the likelihood of tunneling. Although GaAs energy bandgap seems to be significantly beyond a silicon energy bandgap, it does have fast electron mobility and minimal tunneling mass, contributing to enhanced current drivability at the interface. In contrast, with the standard DLTFET and tunnel junction engineered DLTFET (GaAs-DLTFET) we properly assessed the DC and analog/RF values in specific terms of energy band diagram, electric field, carrier concentrations, transfer characteristics, transconductance, parasitic capacitance, cutoff frequency. The simulation of the conventional DLTFET and proposed device (GaAs-DLTFET) has been performed using the ATLAS device simulator. The proposed device has shown an increased ON-current (~100 μA/μm) and improved subthreshold swing (~10.25 mV/decade). The excellent characteristics are demonstrated by GaAs-DLTFET and linearity parameters are analyzed to give the justification that a device is a worthy option for future high-frequency analog/RF applications with minimal use of operational power.
用于低功耗应用的隧道结工程无掺杂TFET的设计
无掺杂隧道场效应晶体管(DLTFET)的出现取代了MOSFET,成为新兴技术中具有前景的小功率应用。而在本文中,我们制作了一个新的基于DLTFET的电荷等离子体隧道结。砷化镓(GaAs)口袋位于硅膜的源和通道界面周围,增加了隧道的可能性。虽然砷化镓的能带隙似乎远远超过硅的能带隙,但它确实具有快速的电子迁移率和最小的隧道质量,有助于增强界面上的电流可驱动性。相比之下,使用标准DLTFET和隧道结工程DLTFET (GaAs-DLTFET),我们在能带图、电场、载流子浓度、转移特性、跨导、寄生电容、截止频率等具体方面正确评估了DC和模拟/RF值。利用ATLAS器件模拟器对传统DLTFET和提出的器件(GaAs-DLTFET)进行了仿真。该器件的导通电流提高了~100 μA/μm,亚阈值摆幅提高了~10.25 mV/ 10年。通过GaAs-DLTFET展示了其优异的特性,并分析了线性参数,以证明该器件是未来高频模拟/RF应用的值得选择,且使用的工作功率最小。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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