10W power amplifier and 3W transmit/receive module with 3 dB NF in Ka band using a 100nm GaN/Si process

A. Gasmi, M. El Kaamouchi, J. Poulain, B. Wroblewski, F. Lecourt, Gulnar Dagher, P. Frijlink, R. Leblanc
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引用次数: 44

Abstract

This paper presents two Monolithic Microwave Integrated Circuits (MMIC) designed and fabricated with the same 100 nm Gallium Nitride on Silicon (GaN/Si) millimeter wave process, demonstrating the excellent multipurpose capability of this technology. The first circuit is a 29–33 GHz power amplifier, presenting 10 W of output power in pulsed operation and 8 W is CW operation. The second MMIC is a 26–34 GHz Transmit/Receive chip (T/R chip), including on the same chip a Low Noise Amplifier (LNA), a Power Amplifier (PA) and a SPDT switch. In the 28–34 GHz frequency bandwidth, this T/R chip, including the switch losses, presents an output power of 35–36 dBm and a Noise Figure of 2.7 dB with an associated gain of 18 dB for the receive and transmit paths.
10W功率放大器和3W发射/接收模块,3db NF在Ka波段,采用100nm GaN/Si工艺
本文介绍了采用相同的100 nm氮化镓/硅(GaN/Si)毫米波工艺设计和制造的两种单片微波集成电路(MMIC),证明了该技术具有优异的多用途性能。第一个电路是29-33 GHz功率放大器,脉冲工作时输出功率为10 W,连续工作时输出功率为8 W。第二个MMIC是一个26-34 GHz的收发芯片(T/R芯片),在同一芯片上包括一个低噪声放大器(LNA),一个功率放大器(PA)和一个SPDT开关。在28-34 GHz频段,该收发芯片包括开关损耗在内的输出功率为35-36 dBm,噪声系数为2.7 dB,接收和发射路径相关增益为18 dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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