An Intelligent Error Compensation Method for Height Measurement of Bump Package

2021 IEEE 15th International Conference on Anti-counterfeiting, Security, and Identification (ASID) Pub Date : 2021-10-29 DOI:10.1109/asid52932.2021.9651681

Ruiqian Ye, Peng Zheng, Yun Gao, Chun Lin, Zili Zhang, Fanchang Meng

{"title":"An Intelligent Error Compensation Method for Height Measurement of Bump Package","authors":"Ruiqian Ye, Peng Zheng, Yun Gao, Chun Lin, Zili Zhang, Fanchang Meng","doi":"10.1109/asid52932.2021.9651681","DOIUrl":null,"url":null,"abstract":"The coplanarity of the bump height is the guarantee of packaging quality. Optical triangulation is a widely used method to measure the bump height. However, it is not easy to accurately measure the bump height due to its small size, curved and highly reflective surface. In order to solve the problem of poor stability in triangulation measurement when using light strip center extraction, we analyzed the error reasons in a white light triangulation based bump height measurement. Then, an improved gray centroid method was applied to extract the light strip center on the base wafer and the light spot on the bump top. Next, the calibration results was combined to calculate the initial bump height. Finally, two features of the light strip and light spot were detected to train a multilayer perceptron to obtain an intelligent compensation for the bump height. It was proved that the standard deviation and the extreme difference of bump height are reduced to at least 1/2 after using our compensation method. The average standard deviation was reduced from 0.651um to 0.281um, as well as the average extreme difference was reduced from 1.790um to 0.689um. The result can meet the requirements of most of the bump package.","PeriodicalId":150884,"journal":{"name":"2021 IEEE 15th International Conference on Anti-counterfeiting, Security, and Identification (ASID)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE 15th International Conference on Anti-counterfeiting, Security, and Identification (ASID)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/asid52932.2021.9651681","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

Abstract

The coplanarity of the bump height is the guarantee of packaging quality. Optical triangulation is a widely used method to measure the bump height. However, it is not easy to accurately measure the bump height due to its small size, curved and highly reflective surface. In order to solve the problem of poor stability in triangulation measurement when using light strip center extraction, we analyzed the error reasons in a white light triangulation based bump height measurement. Then, an improved gray centroid method was applied to extract the light strip center on the base wafer and the light spot on the bump top. Next, the calibration results was combined to calculate the initial bump height. Finally, two features of the light strip and light spot were detected to train a multilayer perceptron to obtain an intelligent compensation for the bump height. It was proved that the standard deviation and the extreme difference of bump height are reduced to at least 1/2 after using our compensation method. The average standard deviation was reduced from 0.651um to 0.281um, as well as the average extreme difference was reduced from 1.790um to 0.689um. The result can meet the requirements of most of the bump package.

查看原文本刊更多论文

凸包高度测量的智能误差补偿方法

凸包高度的共平面性是包装质量的保证。光学三角测量是一种广泛使用的测量凸起高度的方法。然而，由于其体积小，弯曲和高反射表面，不容易准确测量凸起高度。为了解决光条中心提取在三角测量中稳定性差的问题，分析了基于白光三角测量的凸起高度测量中的误差原因。然后，采用改进的灰色质心法提取基片上的光条中心和凸起顶部的光斑;然后，结合标定结果计算初始凹凸高度。最后，检测光条和光点两个特征，训练多层感知器对凸起高度进行智能补偿。实验证明，采用该补偿方法后，碰撞高度的标准差和极值差至少减小到1/2。平均标准差从0.651um减小到0.281um，平均极差从1.79 um减小到0.689um。结果可以满足大多数凹凸包的要求。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

2021 IEEE 15th International Conference on Anti-counterfeiting, Security, and Identification (ASID)

自引率

0.00%

发文量