Physical Design Challenges and Solutions for Emerging Heterogeneous 3D Integration Technologies

Abstract

The emerging heterogeneous 3D integration technologies provide a promising solution to improve the performance of electronic systems in the post-Moore era, but the lack of design automation solutions and the challenges in physical design are hindering the applications of these technologies. In this paper, we discuss multiple types and levels of heterogeneous integration enabled by the high-density 3D technologies. We investigate each physical implementation stage from technology setup to placement and routing, identify the design challenges proposed by heterogeneous 3D integration. This paper provides a comprehensive survey on the state-of-the-art physical design methodologies to address these challenges.