Non-contact Aero-dynamic leadframe Stabling device applied in IC plating system

Abstract

This paper describes a new aero-dynamical lead-frame Stabling & drying device (called Aero-dynamic Air Knife) developed by Leshan-Phoenix Semiconductor Co. Ltd. (LPS) and Local company. This device is integrated into the traditional strip to strip belt plating system for preventing thinner or flimsy leadframe from damaging and jamming, especially in the air knife station. The traditional air knife is using compressed air to directly blow & dry/clean the strips before moving to next process, but it will cause air turbulent due to unbalance of air blow from both-sides, which results in leadframe swing in the process cell, or jamming and damage, especially for the thinner and wider leadframe. The new designed aerodynamic Leadfram Stabling Device is based on aerodynamic theory and air amplifier concept to establish a high speed stable air stream field passing through the strip surface to stabilize the leadframe within a small range of the balanced centering position of process cells and get more effective to dry and clean strips with the strong air-blow. It ensures the leadframe to be self-centered & transferred through process cells smoothly without any mechanical contact. This design not only dries the strip from water and chemical solution, but also prevents strips deformation, jamming and drops from hitting mechanical parts. It's helpful to reduce the consumption of plating process chemical, DI water & compressed air supply and save water treatment cost. The result shows this new designed non-contact leadframe Stabling Device is applicable in plating process and proven to be most effective with more than 70 mm width and less than 0.11 mm thickness high-density leadframe. The innovation of Non-contact leadframe stabling & drying air knife got National Patent of China, Patent No# ZL2007 2 008 232.8.