K. Sakurai, T. Nishimura, S. Obinata, S. Momota, T. Nakajima, S. Tagami, S. Furuhata, Y. Inakoshi
{"title":"Power MOSFETs having Schottky barrier drain contact","authors":"K. Sakurai, T. Nishimura, S. Obinata, S. Momota, T. Nakajima, S. Tagami, S. Furuhata, Y. Inakoshi","doi":"10.1109/ISPSD.1990.991072","DOIUrl":null,"url":null,"abstract":"A new vertical Schottky barrier gain com tact power MDS~-(KSMISIT) is presented for the first time. The new device has a mique drain structure of Schottky barrier (SB) contact or p-n jvlction ad&d in para1 le1 with the SB contact. istics changes with varying the kind of barrier metal (Pt. and A I ) and the ratio of the SB contact to the total back-surface area. The change arises fran the control of the minority carrier injection resulting in conductivity mo&lation and of the electron conduction path &ring turn off. The VsDMOsms provide hi& blocking voltage, low on-state resistance and fast switching speed. 1000-1200V VQMXFEr with 100% Pt SB contact, for exwle, exhibits about a half of the on-state resistance and the carparable fa1 I time for the conventiwl power NEFEL The omstate resistance and the switching character-","PeriodicalId":162198,"journal":{"name":"Proceedings of the 2nd International Symposium on Power Semiconductor Devices and Ics. ISPSD '90.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2nd International Symposium on Power Semiconductor Devices and Ics. ISPSD '90.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.1990.991072","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
A new vertical Schottky barrier gain com tact power MDS~-(KSMISIT) is presented for the first time. The new device has a mique drain structure of Schottky barrier (SB) contact or p-n jvlction ad&d in para1 le1 with the SB contact. istics changes with varying the kind of barrier metal (Pt. and A I ) and the ratio of the SB contact to the total back-surface area. The change arises fran the control of the minority carrier injection resulting in conductivity mo&lation and of the electron conduction path &ring turn off. The VsDMOsms provide hi& blocking voltage, low on-state resistance and fast switching speed. 1000-1200V VQMXFEr with 100% Pt SB contact, for exwle, exhibits about a half of the on-state resistance and the carparable fa1 I time for the conventiwl power NEFEL The omstate resistance and the switching character-