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Parameters For Point Defect Diffusion And Recombination

Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits Pub Date : 1900-01-01 DOI:10.1109/NUPAD.1990.748251
M. Law
{"title":"Parameters For Point Defect Diffusion And Recombination","authors":"M. Law","doi":"10.1109/NUPAD.1990.748251","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":348970,"journal":{"name":"Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NUPAD.1990.748251","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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点缺陷扩散和复合参数
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Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits
Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits
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