H. Kang, Jong Dae Lee, Joon Ki Kim, Yeong-Kook Kim
{"title":"Analyses on a directly attached airbag sensor packaging system","authors":"H. Kang, Jong Dae Lee, Joon Ki Kim, Yeong-Kook Kim","doi":"10.1109/EUROSIME.2015.7103158","DOIUrl":null,"url":null,"abstract":"A side airbag sensor packaging directlly attached to the side frame (center pillar) of automobiles by adhesive is introduced in this study. To assess the feasibility for the packaging, a test instrument was manufactured to examine the impact sensibility by drop tests. The conventional sensor module with plastic housiung and the new sensor packaging were installed to aluminum channel, and the results were compared with each other. Numerical analyses were also performed to investigate the signal characteristics created by the sensors. The prerliminary results showed that the signals from the directly attached sensors represented more distinctive with less noise, presummably due to the absence of the vibration caused by the housing structure of the conventional sensor.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2015.7103158","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
A side airbag sensor packaging directlly attached to the side frame (center pillar) of automobiles by adhesive is introduced in this study. To assess the feasibility for the packaging, a test instrument was manufactured to examine the impact sensibility by drop tests. The conventional sensor module with plastic housiung and the new sensor packaging were installed to aluminum channel, and the results were compared with each other. Numerical analyses were also performed to investigate the signal characteristics created by the sensors. The prerliminary results showed that the signals from the directly attached sensors represented more distinctive with less noise, presummably due to the absence of the vibration caused by the housing structure of the conventional sensor.