Microstrip circuits on micromachined silicon

J. Hasch, H. Irion, A. Muller
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引用次数: 2

Abstract

Fully monolithic integration of a millimeter wave system on silicon requires low loss passive circuitry. Transmission line elements are needed to interconnect active devices and to realize distributed passive components. Using bulk micromachining and high resistivity silicon on insulator (SOI) wafers, well defined thin silicon membranes can be manufactured. This allows the use of microstrip circuits on silicon substrates at frequencies beyond 100 GHz. Full wave simulation results accompanied by measurements are presented for coplanar to microstrip transitions, microstrip lines and two simple test circuits.
微加工硅上的微带电路
在硅上完全集成毫米波系统需要低损耗无源电路。传输线元件需要实现有源器件的互连和无源器件的分布式。利用体微加工和高电阻率绝缘体硅(SOI)晶圆,可以制造出定义良好的薄硅膜。这允许在硅衬底上使用频率超过100 GHz的微带电路。给出了共面到微带转换、微带线和两种简单测试电路的全波仿真结果和测量结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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