Flexible manufacturing of multichip modules for flip chip ICs

Abstract

A quick-turn flexible process for designing, verifying, and manufacturing multichip modules for use with flip chip ICs was developed. The process starts with MCC's prefabricated customizable substrates. Laser based cut and link processes are used to program the necessary wires on the substrate. Laser direct write is also used to redistribute the flip chip area array bond pads to match the bond pads on the substrate. An efficient design to manufacturing process is assisted with the use of a software tool that allows the user to place and route the interconnections, and prepares the information needed for fabrication of the multichip modules.