Development of the RIT infrastructure for design, fabrication and testing of small multichip modules

Abstract

The infrastructural work in progress at the Rochester Institute of Technology in the area of the multichip modules is described. Facilities for design, fabrication and testing are being developed. Present capabilities as well as future goals are presented. The MCM effort is a joint effort between the Electrical Engineering department and the Microelectronic department. Issues related to design, simulation (electrical and thermal) and testing are being addressed in the Electrical Engineering department. Mask making, fabrication, and final packaging are being handled by the Microelectronic Engineering department. The facilities, technology and projects (ongoing and future) in this endeavor are considered.<>