Air Cooling Of Mcms Mounted On Card-on- Board Packaging Systems

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI:10.1109/IEMT.1993.639761

A. Harada, Y. Kaneko, T. Kishimoto

引用次数: 1

Abstract

A b s t r m This paper discusses the air cooling characteristics of telecommunications multichip modules (MCMs) mounted on a card-on-board (COB) system. The main issues are to achieve a suitable baffle plate height and an optimum air flow system. We also examined the cooling performance under fan failures. A flow control guide structure provides a minimum thermal resistance of 6.5-7.6"CMI. Allowable power dissipation per MCM is 95-110 W at an allowable temperature rise of 45°C.

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安装在板载包装系统上的Mcms的空气冷却

本文讨论了安装在卡板(COB)系统上的通信多芯片模块(mcm)的风冷特性。主要问题是要达到一个合适的挡板高度和一个最佳的气流系统。我们还测试了风扇故障情况下的冷却性能。流动控制导向结构提供了6.5-7.6“CMI的最小热阻。在允许温升45℃时，每个MCM的允许功耗为95 ~ 110w。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of Japan International Electronic Manufacturing Technology Symposium

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