M. Dumitrescu, C. Cobianu, D. Lungu, D. Dascalu, A. Pascu, A. van den Berg, J. Gardeniers, S. Kolev, C. Ducso, I. Bársony
{"title":"Identification of temperature profile and heat transfer on a dielectric membrane for gas sensors by \"COSMOS\" program simulation","authors":"M. Dumitrescu, C. Cobianu, D. Lungu, D. Dascalu, A. Pascu, A. van den Berg, J. Gardeniers, S. Kolev, C. Ducso, I. Bársony","doi":"10.1109/SMICND.1997.651567","DOIUrl":null,"url":null,"abstract":"The application of commercial 3-D software \"COSMOS\" for the design and thermal analysis of the low power consumption test structures with dielectric membrane for gas microsensors is presented. Within this work, the simulation provides the estimation of the temperature profile on the active area and the whole membrane including the four bridges and the heating efficiency in the temperature range 20-500/spl deg/C. Unravelling of the heat loss mechanisms in terms of radiation, convection, conduction by air and solid materials during heat transfer on the dielectric membrane is reported for the first time as a mean to evaluate by 3-D simulation the contribution of technological processes and lay-out design to the total heat losses.","PeriodicalId":144314,"journal":{"name":"1997 International Semiconductor Conference 20th Edition. CAS '97 Proceedings","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 International Semiconductor Conference 20th Edition. CAS '97 Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMICND.1997.651567","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
The application of commercial 3-D software "COSMOS" for the design and thermal analysis of the low power consumption test structures with dielectric membrane for gas microsensors is presented. Within this work, the simulation provides the estimation of the temperature profile on the active area and the whole membrane including the four bridges and the heating efficiency in the temperature range 20-500/spl deg/C. Unravelling of the heat loss mechanisms in terms of radiation, convection, conduction by air and solid materials during heat transfer on the dielectric membrane is reported for the first time as a mean to evaluate by 3-D simulation the contribution of technological processes and lay-out design to the total heat losses.