Role of in-line defect sampling methodology in yield management

Abstract

This paper presents a comprehensive methodology for yield management based on in-line defect inspection. Using the data from fabs we demonstrate algorithms for computing the sampling plan in terms of the number of lots and wafers per lot to sample at different process steps. In making those computations we take into account in-line defect based yield estimation techniques and simulation based sensitivity selection. The in-line defect data presented in this paper are obtained using KLA 21XX wafer inspection systems from fabs across the world.