3-D Large-Scale IC/MEMS Co-Integration Using Liquid Solder for Flip-Chip Assembly

Abstract

In this paper, we discuss a flip-chip packaging method using liquid solder for 3D large-scale electronic/MEMS co-integration. This approach has been inspired from self-assembly technique which is emerging as one of the main methods for fabrication of heterogeneous micro-and nano-systems. We proposed to form solder bump by coating liquid solder directly on electrodes of a MEMS chip based on sophisticate microstructures of electrostatic microactuator array. Self-alignment and assembly techniques for electronic receptor chip were also detailed in order to achieve efficient flip-chip of MEMS and Electronic chip without any stiction and contamination problem. Functionality of the system has been validated and perspectives discussed.