Oxidation Behavior and Intermetallic Compounds Growth of Sn-Ag-Bi-Cr Lead-free Solder

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI:10.1109/ICEPT.2007.4441468

Huang Wang, A. Hu, Cheng Li, D. Mao

引用次数: 5

Abstract

Concentrations of 0.1. 0.3. and 0.5 wt.% of Cr were added to Sn-3Ag-3Bi alloy to produce Sn-Ag-Bi-Cr alloys. The microstmcture is refined with Cr additions, while significantly improves the oxidation resistance. There is no change in the wettability and liquidus temperature after Cr additions. In addition, the effect of Cr addition on the intermetallic compounds was discussed.

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Sn-Ag-Bi-Cr无铅钎料的氧化行为和金属间化合物生长

浓度为0.1。0.3. 在Sn-3Ag-3Bi合金中加入0.5 wt.%的Cr，制得Sn-Ag-Bi-Cr合金。Cr的加入细化了微观组织，同时显著提高了抗氧化性能。Cr的加入对润湿性和液相温度没有影响。此外，还讨论了Cr的加入对金属间化合物的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2007 8th International Conference on Electronic Packaging Technology

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