Highly accelerated stress test (HAST) for low-cost flip chip on board technology

Abstract

Flip chip on board (FCOB) technology has been in widespread application. The reliability testing of solder-joints and the delamination between underfill and chip or substrate is still a critical issue for FCOB technology. In this paper, an accelerated environmental testing HAST-was used to rapidly evaluate the reliability of area array solder bumped packages on FR-4 PCBs. The test results intend to identify the effective reliability test criteria for low-cost FCOB technology.