{"title":"A >0mW SSPA from 76-94GHz, with Peak 28.9% PAE at 86GHz","authors":"Z. Griffith, M. Urteaga, P. Rowell, R. Pierson","doi":"10.1109/CSICS.2014.6978526","DOIUrl":null,"url":null,"abstract":"A 69.5-94.0GHz solid-state power amplifier MMIC is presented in 250nm InP HBT, where from 76-94GHz it demonstrates >200mW Pout with simultaneous >23.5% PAE, 11dB compressed gain and 694mW PDC. At 86GHz operation, 232mW Pout with peak 28.9% PAE is observed - this corresponds to 1.21W/mm linear power density. This 2-stage amplifier has a flat S21 mid-band gain of 14-15dB, and the 1dB small-signal gain roll-off is between 66-96GHz. The large-signal Psat bandwidth is between 69.5-94GHz. This SSPA utilizes a novel, compact power cell topology developed for multi-finger HBTs, which overcomes the inability of the RF output interconnects and combiners to carry the high DC bias currents required by the HBT PA cells in the thin-film microstrip interconnect. Across the 76-94GHz bandwidth, P1dB gain compression Pout is >118mW which corresponds to ≥ 14.5% PAE; this is a relevant RF operating point where higher linearity operation may be required. This work improves upon the state-of-the-art for E-, and W-Band SSPAs by demonstrating 6x higher bandwidth (24.5GHz largesignal bandwidth) while having high PAE > 23.5%. This compact approach can permit an additional 4× or 8× power combining and in-turn a monolithic 1-1.5W Pout SSPA in this 250nm InP HBT technology at Eand W-band.","PeriodicalId":309722,"journal":{"name":"2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2014-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSICS.2014.6978526","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
A 69.5-94.0GHz solid-state power amplifier MMIC is presented in 250nm InP HBT, where from 76-94GHz it demonstrates >200mW Pout with simultaneous >23.5% PAE, 11dB compressed gain and 694mW PDC. At 86GHz operation, 232mW Pout with peak 28.9% PAE is observed - this corresponds to 1.21W/mm linear power density. This 2-stage amplifier has a flat S21 mid-band gain of 14-15dB, and the 1dB small-signal gain roll-off is between 66-96GHz. The large-signal Psat bandwidth is between 69.5-94GHz. This SSPA utilizes a novel, compact power cell topology developed for multi-finger HBTs, which overcomes the inability of the RF output interconnects and combiners to carry the high DC bias currents required by the HBT PA cells in the thin-film microstrip interconnect. Across the 76-94GHz bandwidth, P1dB gain compression Pout is >118mW which corresponds to ≥ 14.5% PAE; this is a relevant RF operating point where higher linearity operation may be required. This work improves upon the state-of-the-art for E-, and W-Band SSPAs by demonstrating 6x higher bandwidth (24.5GHz largesignal bandwidth) while having high PAE > 23.5%. This compact approach can permit an additional 4× or 8× power combining and in-turn a monolithic 1-1.5W Pout SSPA in this 250nm InP HBT technology at Eand W-band.