Boundary scan adaption for active substrate MCM-test

Abstract

A MCM test strategy using boundary scan-cells integrated into silicon substrates is presented. The differences between IC-based boundary scan and active substrate boundary scan and their effects on scan-cell placement and design are highlighted. A yield optimized partition of the test circuitry and an adaption to commercially available boundary scan test systems is proposed. Active substrates with boundary scan test capabilities are fabricated based on the identified requirements. The adaption to the test system is evaluated.