Numerical analysis of the thermal behavior sensitivity to technology parameters and operating conditions in InGaP/GaAs HBTs

Abstract

This paper presents an extensive numerical analysis of the thermal behavior of InGaP/GaAs HBTs in a laminate (package) environment. The combination between the Design of Experiments technique and a fast and accurate simulation capability is adopted to quantify the impact of all the key technology parameters and explore a wide range of operating conditions.