Matched expansion probe cards

Abstract

Summary form only given. When testing IC's on a wafer prober a standard state of the art probe card will show a dislocation of the probe needles relative to the pad positions at elevated temperature. By separating electrical and mechanical features it is possible to have matched expansion while the actual electrical adaption of the user remains unmodified. The Matched Expansion Probe Card offers this feature for application over a range of temperatures which may be offset more than +/-200/spl deg/C from the temperature of manufacturing. The only limitations of this solution are the stability of the embedment and the liquidus temperature of the solder used. By this method the manufacturer and the maintenance group can save the need of using a hotchuck and protecting gloves. The application is field proven up to 135/spl deg/C and is actually field tested at 185/spl deg/C. Temperatures above 250/spl deg/C for electro-migration measurements have been performed in a laboratory environment.