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Plasma Enhanced Cvd Method For Simultaneous Deposition On Both Sides Of The Substrate And Lts Application To The In-line Multilayer Deposition System

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI:10.1109/IEMT.1993.639285
Y. Kokaku, H. Inaba, H. Kataoka, K. Abe, M. Sunagawa
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在衬底两侧同时沉积的等离子体增强Cvd方法及其在在线多层沉积系统中的应用
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Proceedings of Japan International Electronic Manufacturing Technology Symposium
Proceedings of Japan International Electronic Manufacturing Technology Symposium
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