Study of Measurement Index on the Polymer-to-Metal Direct-adhesion for Package Carrier

Abstract

This study will explore the main influencing factors of copper surface roughness and the measurement methods for monitor copper surface morphology. As a result, we found that with the same copper surface roughness (Ra), delamination occurs between the copper surface of the substrate and solder mask, but the ratio of copper surface developing, SDR, of the two is significantly different. In this paper, we will discuss the main influencing factors of copper surface morphology, etching amount, the relationship between Ra and SDR, and discuss the difference between the measurement methods.