{"title":"ILP Based Gate Leakage Optimization Using DKCMOS Library during RTL Synthesis","authors":"S. Mohanty","doi":"10.1109/ISQED.2008.9","DOIUrl":null,"url":null,"abstract":"In this paper dual-K (DKCMOS) technology is proposed as a method for gate leakage power reduction. An integer linear programming (ILP) based algorithm is proposed for its optimization during architectural synthesis. The algorithm uses device-level gate leakage models for precharacterizing register-transfer level (RTL) datapath component library and minimizes the leakage delay product (LDP). The proposed algorithm is tested for several circuits for 45nm CMOS technology node. The experiments show that average gate leakage reduction are 67.7 % and 80.8 % for SiO2- SiON and SiO2-Si3N4, respectively.","PeriodicalId":243121,"journal":{"name":"9th International Symposium on Quality Electronic Design (isqed 2008)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"9th International Symposium on Quality Electronic Design (isqed 2008)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2008.9","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
In this paper dual-K (DKCMOS) technology is proposed as a method for gate leakage power reduction. An integer linear programming (ILP) based algorithm is proposed for its optimization during architectural synthesis. The algorithm uses device-level gate leakage models for precharacterizing register-transfer level (RTL) datapath component library and minimizes the leakage delay product (LDP). The proposed algorithm is tested for several circuits for 45nm CMOS technology node. The experiments show that average gate leakage reduction are 67.7 % and 80.8 % for SiO2- SiON and SiO2-Si3N4, respectively.