The current distribution and heat localization in the integrated circuits plating at the effect of electromagnetic fields

2000 10th International Crimean Microwave Conference. "Microwave and Telecommunication Technology". Conference Proceedings (IEEE Cat. No.00EX415) Pub Date : 2000-09-11 DOI:10.1109/CRMICO.2000.1256190

Ye.P. Taran, V. Starostenko, Ye.V. Grygoriev, D.E. Lashennikov

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Abstract

The numerical researches on investigation of current distribution nature in plating are conducted at the effect of electromagnetic fields. The mechanisms leading to microscopic degradation of plating and edge effects origin are detected.

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电磁场作用下电镀集成电路中的电流分布和热局部化

在电磁场的作用下，对电镀中的电流分布特性进行了数值研究。分析了镀层微观降解的机理和边缘效应的成因。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2000 10th International Crimean Microwave Conference. "Microwave and Telecommunication Technology". Conference Proceedings (IEEE Cat. No.00EX415)

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