Integrated intelligent optimized dynamic scheduling of semiconductor fabrication facilities

Abstract

Semiconductor wafer fabrication facilities (fabs) cry for optimized dynamic scheduling approach due to its high uncertainty and complexity. A novel intelligent optimized dynamic scheduling method, integrating intelligent sequencing with dynamic dispatching, is proposed (abbreviated as ODC). ODC includes three sub-algorithms, i.e., a Partheno-Genetic Algorithm (PGA) to obtain optimized sequencing plan, a dispatching rule (DR) to achieve dynamic dispatching solution and a coordination algorithm (CA) to integrate PGA with DR. A simplistic model, but with essential characteristics of semiconductor wafer fabs, is used to verify and validate the efficiency of ODC. It is shown that ODC is superior to PGA, DR and FIFO with better performance of mean cycle time (MCT), makespan and on-time delivery (OTD) under uncertain environments.