Innovative RF Device Technologies for Advanced Information and Communications Network Society

K. Makiyama, Shigeki Yoshida, K. Nakata, Y. Miyamoto
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Abstract

This paper describes the innovation of RF device technologies for wireless communication. Over the last decade, data traffic on the internet has increased exponentially. In particular, data traffic over wireless networks has exploded due to IoT including mobile phones. Since the 1990s, global wireless communication systems and personal cellular services, have evolved from 1G to 4G in order to meet the huge demand for wireless communication. Recently we are focusing on the research and development of devices and amplifiers for 5G, which is being implemented, and beyond 5G and 6G, which are on the horizon. The 5G system consists of many macro cells and small cells, and its power consumption is enormous. The high efficiency and high- power density of GaN devices decreases the power consumption of the whole system. Up to now, ongoing research on N-polar GaN has demonstrated an extremely high-power and high PAE at W-band. Recently we demonstrated innovative high-k MIS N-polar GaN HEMTs which were fabricated, for the first time, using commercial 4-inch wafer process facilities. We overcame the challenge of developing a vital gate insulating film by incorporating Si LSI material technology. Furthermore, a ScAlN/GaN HEMT with high polarization and lattice-matching is also promising. An AlN/GaN HEMT on AlN substrate achieves high current density without heating up. Heat dissipation technology is a critical method of improving device performance and efficiency. Moreover, we developed a novel passivation technology to control the electric flux lines using dielectric potions as a new engineering method for controlling the electric field of devices. This paper reports these innovative technologies for RF devices and amplifiers.
面向先进信息与通信网络社会的创新射频器件技术
本文介绍了无线通信中射频设备技术的创新。在过去的十年中,互联网上的数据流量呈指数级增长。特别是,由于包括手机在内的物联网(IoT),无线网络上的数据流量呈爆炸式增长。自20世纪90年代以来,全球无线通信系统和个人蜂窝业务已经从1G发展到4G,以满足对无线通信的巨大需求。最近,我们专注于正在实施的5G以及即将推出的5G和6G之外的设备和放大器的研发。5G系统由许多宏蜂窝和小蜂窝组成,其功耗巨大。氮化镓器件的高效率和高功率密度降低了整个系统的功耗。到目前为止,正在进行的n极性GaN研究已经在w波段展示了极高的功率和高PAE。最近,我们展示了创新的高k MIS n极GaN hemt,首次使用商业4英寸晶圆工艺设施制造。我们克服了开发一个重要的栅极绝缘膜的挑战,结合硅LSI材料技术。此外,具有高极化和晶格匹配的ScAlN/GaN HEMT也很有前景。在AlN衬底上的AlN/GaN HEMT实现了高电流密度而不加热。散热技术是提高器件性能和效率的重要手段。此外,我们开发了一种新的钝化技术来控制电通量线,作为控制器件电场的一种新的工程方法。本文报道了这些用于射频器件和放大器的创新技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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