{"title":"Highly-Efficient Broadband Millimeter-Wave 5G Power Amplifiers in GaN, SiGe, and CMOS-SOI","authors":"D. Lie, J. Mayeda, Jerry Lopez","doi":"10.1109/RFIT49453.2020.9226215","DOIUrl":null,"url":null,"abstract":"We present several broadband high-efficient power amplifier (PA) designs for potential millimeter-wave (mm-Wave) 5G (5th Generation) applications. The PA is targeted to cover the key part of 5G FR2 band (i.e., 24.25 to 43.5 GHz), with $P_{OUT, MAX}$ ≥ 16 dBm and peak power-added-efficiency (PAE) above 30%. We use advanced mm-Wave IC technologies in 40 nm GaN, 22 nm CMOS FD-SOI, and 90 nm SiGe BiCMOS processes to prototype medium-power mm-Wave 5G PAs. Post-layout simulations and preliminary measurement data indicates the PAs should be able to meet the performance targets, and there are design trade-offs on $P_{OUT, MAX}$ and PAE due to different device technologies, circuit topologies (differential, cascode), biasing, matching network, etc.","PeriodicalId":283714,"journal":{"name":"2020 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RFIT49453.2020.9226215","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
We present several broadband high-efficient power amplifier (PA) designs for potential millimeter-wave (mm-Wave) 5G (5th Generation) applications. The PA is targeted to cover the key part of 5G FR2 band (i.e., 24.25 to 43.5 GHz), with $P_{OUT, MAX}$ ≥ 16 dBm and peak power-added-efficiency (PAE) above 30%. We use advanced mm-Wave IC technologies in 40 nm GaN, 22 nm CMOS FD-SOI, and 90 nm SiGe BiCMOS processes to prototype medium-power mm-Wave 5G PAs. Post-layout simulations and preliminary measurement data indicates the PAs should be able to meet the performance targets, and there are design trade-offs on $P_{OUT, MAX}$ and PAE due to different device technologies, circuit topologies (differential, cascode), biasing, matching network, etc.