The value and effectiveness of sensor trace analytics in solving yield impact issues: A case study

Abstract

Improving and maintaining production yield is critical for any manufacturing, therefore, one of the key responsibilities for engineers working in a semiconductor fab is to solve wafer yield issues in a timely manner. Traditional approach in root cause analysis requires multiple tools, multiple steps, and multiple domain resources. Time to solve a wafer yield issue could require days or weeks. To address this, engineers have started leveraging advanced data analytic software solutions to gain better insights and to help expedite the root cause analysis process. In this paper, the advantages of using a trace analytics software tool for root cause analysis is illustrated through an actual use case.