Numerical investigation of radiated emissions mechanisms in single-chip packages

Abstract

Presents preliminary results for a new way of addressing radiated emissions from packaged electronic systems. We have validated the FDTD methodology for determining the peak radiation frequencies for a simple microstrip transmission line structure. Also, we have demonstrated the impact of placing ground pins between the signal and absolute ground planes on the radiation characteristics of a microstrip line capacitively coupled to an absolute ground. The placement and location of grounding pins is critical to the reduction of EMI.