A temperature compensated architecture for integrated, low power, frequency domain sensors

K. Allidina, T. Saha, M. El-Gamal
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引用次数: 4

Abstract

This paper presents an electronic interface architecture for frequency domain capacitive and resonant sensors. The architecture provides temperature compensation without needing a high resolution temperature sensor or an integrated heater. Furthermore, it provides a fully digital output without needing a temperature independent clock to operate the time-to-digital converter. The electronic interface is analyzed theoretically for application with a MEMS-based capacitive humidity sensor, and behavioral-level simulation results are provided to verify operation. Due to the low component count and inherent temperature compensation, this architecture is well suited for compact, low power, and low cost sensing solutions in general.
温度补偿架构集成,低功耗,频域传感器
提出了一种用于频域电容式和谐振式传感器的电子接口结构。该架构无需高分辨率温度传感器或集成加热器即可提供温度补偿。此外,它提供了一个全数字输出,而不需要一个温度无关的时钟来操作时间-数字转换器。从理论上分析了该电子接口与基于mems的电容式湿度传感器的应用,并提供了行为级仿真结果来验证其运行。由于低元件数量和固有的温度补偿,这种架构非常适合于紧凑、低功耗和低成本的传感解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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