Practical resolution limit of KrF lithography

R. Schuster
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引用次数: 2

Abstract

Since lithography represents a major part of chip manufacturing costs it is desirable to extend KrF optical lithography to 0.15 /spl mu/m design rules and beyond. This paper discusses the resolution limits that can be achieved with state-of-the-art 0.68 NA exposure systems and optical enhancement techniques such as modified illumination, phase shift masks and optical proximity corrections. The goal is to optimize the imaging process to achieve process windows large enough for use in a manufacturing environment.
KrF光刻的实际分辨率极限
由于光刻是芯片制造成本的主要部分,因此希望将KrF光学光刻扩展到0.15 /spl mu/m的设计规则甚至更高。本文讨论了最先进的0.68 NA曝光系统和光学增强技术(如修改照明、相移掩模和光学接近校正)可以实现的分辨率限制。目标是优化成像过程,以实现在制造环境中使用的足够大的过程窗口。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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